Sensor Fabrication Methods

1. Electrostatic Damage Prevention Chip Stacking Method

Large Sensor Diagram

  1. Sensor Chip Without Input Protection Circuit
  2. Shunt Wire or Seed Layer
  3. Micro Bump
  4. Lower-Layer Chip With an Input Protection Circuit
  5. Input/Output Terminals
  6. Horizontal and Vertical Parallel Scanning Circuit

2. Chip Sidewall Flattening Dicing Method

To enable sensor chip tiling, a precise wafer dicing method along the scribe lines is essential.

Chip Dicing Diagram

 

Conventional Blade Dicing

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Chip Dicing Diagram

 

Dicing by Precision Laser or Deep RIE